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- Compliant - to ISO, DFARS and Military Standard Requirements
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- ISO Certified
- Military Testing in House- MIL-PRF-38534, QML-38534, NSN5962
- Design Engineering- Solidworks, CAD
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CPS Technologies Corporation 11 Worcester Street Norton, MA 02766 www.alsic.com |
Total vertical integration for hermetic packaging and AlSiC component manufacturing. Custom casting, machining and assembly capability with onsite military testing services.
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Laser Processing Technology12021 N. E. Airport Way - Suite CPortland, OR 97220 www.lpt-inc.com |
Premier laser machining source for scribing, drilling, coating, and annealing of metals, plastics ceramics, glass and more.
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Minco Technology Labs, Inc.1805 Rutherford LaneAustin, TX 78754 www.mincotech.com |
The leading semiconductor processor, assembler and tester serving the medical, military, space and commercial industries. Reestablished its custom packaging division with additional emphasis in standard part packaging, known good die processing, and other high-reliability applications.
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Remtec100 Morse StreetNorwood, MA 02062 www.remtec.com |
Serves needs in advanced ceramic packaging technology for high power and broad frequency applications. PCTF® Ceramic Metalization Technology is utilized in the design and fabrication of metalized ceramic boards, chip carriers, and packages.
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- Hermetic Packages- Kovar, Cold Rolled Steel Aluminum, AlSiC, Titanium, Stainless Steel
- AlSiC Components- IGBT Baseplates, Heatsinks, Coolers
- Lids- for Flipchip, Microprocessors, Microwave and Optoelectronic Housings
- Thick/Thin Film Substrates- BeO, AlO
- Metalization, Laser Processing, and Diamond Sawing- BeO, AlO, Plastics, Metals and Exotic Materials
- Hybrid Assemblies- HIC/MCM in Flatpack, DIP and SIP
- Bare Die and Processing- Customer or Vendor Supplied Die and Processing at the Wafer Level
- Testing Services- Advanced Test Solutions Designed to Evaluate Component Reliability
- Memory- Microcircuit Manufacturing for Hi-Rel Memory Products
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