Total vertical integration for hermetic packaging and AlSiC component manufacturing. Custom casting, machining and assembly capability with onsite military testing services.

 Metalization of substrates to complete assembly and testing of HIC and MCM. Assembly in clean rooms of class 1000 and class 100,000. Manufacturing with high volume pick and place equipment.

 Premier laser machining source for scribing, drilling, coating, and annealing of metals, plastics ceramics, glass and more.

The leading semiconductor processor, assembler and tester serving the medical, military, space and commercial industries. Reestablished its custom packaging division with additional emphasis in standard part packaging, known good die processing, and other high-reliability applications.

Serves needs in advanced ceramic packaging technology for high power and broad frequency applications. PCTF® Ceramic Metalization Technology is utilized in the design and fabrication of metalized ceramic boards, chip carriers, and packages.